Thermoelectrics and Thermal Management Team

Moore, S.; Takahashi, M.; Sauerschnig, P.; Kobayashi, K.; Higashimine, K.; Miyata, M.; Baba, T.; Uzuhashi, J., Ohta, M.; Mori, T.; Ohkubo, T.; Maenosono, S., Mechanistic Insight into the Effect of Cu Doping on Thermoelectric Properties of Sintered Wet-Chemically Synthesized SnSe2 Nanosheets, ACS Appl. Energ. Mater. 2024, 7, 7467–7477, 10.1021/acsaem.4c01698
Published AUG 26 2024
Kobayashi, K.; Takahashi, M.; Moore, S.; Miyata, M.; Sauerschnig, P.; Uzuhashi, J.; Ohta, M.; Ohkubo, T., Maenosono, S., Electronic and Thermal Transport Properties of Nanostructured Thermoelectric Materials Sintered from Chemically Synthesized Tin Sulfide Nanoparticles and Effects of Ag and Se Doping, ACS Appl. Energ. Mater. 2024, 7, 4484–4493, 10.1021/acsaem.4c00487
Published MAY 16 2024
Imasato K.; Miyazaki, H.; Sauerschnig P.; Johari, K. K.; Ishida, T.; Yamamoto, A.; Ohta, M.;, Achieving Compatible p/n-Type Half-Heusler Compositions in Valence Balanced/Unbalanced Mg 1–xVx NiSb, ACS Appl. Mater. Interfaces. 2024, 16, 11637, 10.1021/acsami.3c16324
Published FEB 26 2024
Le Tonquesse, S.; Bouteiller, H.; Matsushita, Y.; Cortez, A.; Bux, S. K.; Imasato, K.; Ohta, M.; Halet, J.-F.; Mori, T.; Gascoin, F.; Berthebaud, D., Enhanced High-Temperature Thermoelectric Performance of Yb4Sb3 via Ce/Bi Co-doping and Metallic Contact Deposition for Device Integration, ACS Appl. Energ. Mater. 2023, 6, 10088-10097, 10.1021/acsaem.3c01693
Published SEP 22 2023
Hagiwara T.; Suekuni K.; Lemoine P.; Prestipino C.; Elkaim E.; Supka A.R.; AL Orabi R.A.R.; Fornari M.; Guilmeau E.; Raveau B. ;Saito H.; Sauerschnig P. ;Ohta M.; Kanemori Y.; Ohtaki M., Pseudobinary Approach to the Discovery and Design of Copper-Based Sulfides, Chem. Mat. 2023, 35, 7554–7563, 10.1021/acs.chemmater.3c01135
Published SEP 14 2023
Sauerschnig, P.; Jood, P.; Ohta, M., Improved high‐temperature material stability and mechanical properties while maintaining a high figure of merit in nanostructured p‐type PbTe‐based thermoelectric elements, Adv. Mater. Technol. 2023, 8, 2201295, 10.1002/admt.202201295
Published NOV 11 2022
Contact

Contact